ENHANCING THE PERFORMANCE OF SEMICONDUCTOR EQUIPMENT BY PREVENTING BYPRODUCT BUILDUP IN ETCH PROCESS CHAMBER
Keywords:
Semiconductor Design, Etch Chamber, Byproduct Buildup, Yield Loss, Performance, Condensation Curve, CoatingAbstract
Semiconductor fabrication facilities (fabs) are among the most complex and controlled environments in industrial manufacturing. These facilities are tasked with producing highly intricate and precise semiconductor devices, which are integral to nearly every aspect of modern technology, from consumer electronics to advanced computing systems. To meet the rigorous standards required for such devices, semiconductor fabs must maintain an environment where contamination control is paramount, and productivity is maximized.
The consequences of contamination are far-reaching. The Market Requirement Statement (MRS) from the customer specifies strict metal contamination standards, with contamination levels being reduced each year. In addition to particles, byproducts generated during Process recipe pose a serious risk to both the products and the efficiency of the fabrication process. Byproducts are the chemical residues which accumulate on equipment surfaces, which degrade the functionality of machines, and introduce contaminants into the production environment. The accumulation of these byproducts can also reduce the overall efficiency of the production process, leading to lower yields and increased likelihood of device failures. These issues also contribute to increased operational costs and a loss of profitability, as the cost of addressing defects and downtime adds up quickly.
Therefore, to address these issues, it is essential to implement measures that prevent byproduct buildup and particle generation, which will help increase chamber uptime.
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